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PCB Prototype and Production

Circuit Pro Solutions is your PCB partner for rigid and flex circuits. Our excellent front end group will double check your Gerber files to ensure manufacturability - the 1st time. With an around-the-clock crew, delivery of your time sensitive PCBs are guaranteed to ship on time, or earlier.

Click Here for Capabilities Roadmap.

Offerings
  • Up to 44 layers
  • ATE boards: load, burn-in, DUT, probe, mother board systems, daughter boards
  • 30" x 30" maximum panel size
  • Rigid, rigid flex, flex boards (Kapton, PET, PEN materials)
  • RoHS, ISO, UL, Class 3, Medical, Military compliant
  • Asia capabilities for above offerings (except medical & military)
Lead Times
Prototype PCB Fabrication
  • 1 to 5 days - US
  • up to 14 layers in 24 hours
  • 5 to 20 days - Asia
  • 10 days - BEST VALUE

Production PCB Fabrication

  • 2 weeks - FA samples to support production orders
  • 4-5 weeks - flex, rigid flex, rigid designs
Plating
  • HAL (lead free)
  • Immersion tin, silver, gold
  • Hard & soft gold, up to 180 uin
  • OSP
  • Selective plating  
Material
  • Hi temp FR4
  • Polyimide
  • Rogers 4000 series
  • Getek
  • Nelco
  • Others upon request
Lamination
  • Board thickness - .005" to .250"
  • Min core thickness - .002"
Drilling
  • .002" min laser drill through hole
  • 15:1 aspect ratio
  • Depth controlled
Soldermask
  • LPI  (multi colors)
  • Dry film
  • Wet mask
  • Carbon Ink (w/ tolerances)
Testing
  • Flying probe, fixtureless
  • Flying grid
  • Full Net List
  • Polar for controlled impedance
  • Double sided test, 10-100 volt
  • Continuity resistance, 10-30 ohms
  • Isolation resistance, 2.5 to 10.0 MegOhms

Capabilities Roadmap

Board Features Standard Premium Advanced Emerging Comments
Laser Drilling/ Routing - w/vision Available Available Available Available
Lines and Spaces (Outer) .005" .004"-.003" .002" .0025"
Lines and Spaces (Inner) .005" .004"-.003" .002" .0025"
Outer Annual Ring .007" .006"-.003" <.003" .0000000000"
Inner Annual Ring .007" .006"-.003" <.003" .000"/build-up
Hole to Plane Clearance or Conductor 0.013 .012-.007 .006-.0045
Layer to Layer Registration (Core to Core) .005" .004"-.003" .002" Material Dependent
Layer to Layer Registration (Top to Bottom) .005" .004"-.003" .002"
PCB Thickness Tolerance 10% 9 - 5% .002"
Mechanical Drill Hole Minimum .016" .0145"-.006" 0.0059
Laser Drilled Holes .006" .005"-.002" .001"
Aspect Ratio (=/> than .015") 9:1 10:1 - 16:1 17:1 - 20:1 21:1 - 25:1
Controlled Impedance Characteristic 10% 9 - 5% 3% 1 Ohm
Differential 10% 9 - 5%
Fabrication Radius +/-5 degrees +/-5 degrees +/-5 degrees +/-5 degrees
Warpage: flatness of finished board (inch per inch) 0.010 0.008 0.005 0.003
Min Dielectric Thickness 0.004 0.004 0.002 0.001
LPI Soldermask (Dams) .005" .004" - .003" .002"
Layer Count 20 >30 >40 >50
Panel Sizes 12 X 18 18 x 24 20 x 26 22 x 30
Max Board Thickness 0.125 0.200 0.300 <0.300
Min Board Thickness 0.062 0.008 0.006 0.002
Min Board Thickness Tolerance +/- 10% +/-7.5% +/-5%

Pad to Hole Size Standard Premium Advanced Emerging
Min Plated Hole Size 0.010 0.010 0.006 0.002
Tolerance- Plated Hole Size +/-0.003 +/-0.003 +/-0.002 +/-0.001
Min Inner Layer Pad (1 mil annular ring) +/-0.018 +/-0.018 +/-0.012 +/-0.008
over FHS over FHS over FHS over FHS
Mech Min Drill Hole Size 0.010 0.010 0.006 0.004
Laser Min Drill Hole Size 0.006 0.004 0.002
Normal Finished Hole Sizes 0.010 0.008 0.006 0.004
Plane Relief Diameter Over Drilled Hole 0.024 0.02 0.016 0.01
Min Outer Layer Pad (1 mil annular ring) 0.012 0.010 0.008 0.006
over FHS over FHS over FHS over FHS
Min Outer Non Plated Hole to Metal 0.010 0.010 0.008 0.008
Min Inner Non Plated Hole to Metal 0.010 0.010 0.008 0.008
Max Number Holes per Square In (average over board) 200 200 300 1,000
Max Number Holes per Square In (localized density) n/a n/a n/a n/a

Testing Capabilities
Universal Grid Tester (UGT)
Flying Probe Tester:
Min Pitch - 0.005
Min Feature Size - 0.002

Soldermask Criteria Standard Advanced Premium Emerging
SMT Min Pad Spacing 0.008 0.008 0.007 0.007
Line to SMT Min Space 0.005 0.004 0.003 0.003
Min Soldermask Rib 0.005 0.005 0.004 0.003

Materials
FR4 (Di, Multi, Tetra-fuctional)
High Temp FR4 (Di, Multi, Tetra-fuctional)
G200
G-tech
Polyimide
Resin Coated Foil
Thermount (Polyimide)
Thermount (Epoxy)
BT
Glass Reinforced Ceramic
PTFE Woven (D/S & Hybrid MLB)
PTFE Non-Woven (D/S & Hybrid MLB)
PTFE Ceramic (D/S & Hybrid MLB)
Speed Board C Prepreg
Speed Board N Prepreg
Full Array of Bonding Films
Flex (Capton-Upilex/LPI Covercoats)

Material Processing
Omega Ply Buried Resistors
Copper Invar Copper Metal Cors
Heat Sinks (Brass, Copper, & Aluminum)
Hole Filled (Plated over)
CB100 Silver Fill
SD2361 Epoxy Fill

Surface Finishes Standard Advanced Premium Emerging
Hot Air Solder Level (HASL) Min thickness 0.0003 0.0003 0.0002
HASL Max thickness 0.0015 0.0015 0.001
HASL Co Plan +/- 1000 uin +/- 1000 uin +/- 500 uin
OSP
Immersion Gold Thickness 3-5 uin 5-8 uin
Immersion Silver Thickness 10-20 uin 10-20 uin 10-20 uin
Immersion Tin 30-50 uin 30-50 uin
Electrolytic Hard Gold (Knoop Hardness 120 or >) 50 uin
Soft Electrolytic Gold (Knoop Hardness 90 or <)
Electrolytic Nickel
Electroless Nickel
Carbon Coating